ISSN: 2582 - 9734
Vishal, Manoj
CrossRef DOI URL : https://doi.org/10.31426/ijesti.2025.5.8.5611
The exponential growth in power density and miniaturization of modern electronic and mechatronic systems has intensified the need for efficient thermal management. Traditional cooling techniques, such as air-cooled heat sinks and single-phase liquid systems, are increasingly unable to manage the high heat fluxes and localized temperature gradients of high-power electronic components. This review critically examines recent advancements in cooling technologies—focusing on two-phase cooling, microchannel heat exchangers, vapor chambers, nanofluids, and phase-change materials—designed to enhance heat dissipation efficiency and system reliability..
2025
30
